Final Assembly and Box Build

For your final assembly needs we offer the following services:

Ultrasonic Wire Bonding – Interconnecting semiconductor chips to package leads, bare die transistors to Pd-Ag pads, piezoresistive pressure cells, and a variety of other devices, we utilize ultrasonic wire bonding to provide a reliable and repeatable electrical interconnection.

  • Orthodyne Model 360C Ultrasonic aluminum wire bonders
  • Orthodyne Model 3600 Ultrasonic aluminum wire bonders
  • F&K Delvotec gold wire bonders

Underfill (flip chips with Epoxy) – To prevent flip chip solder bumps from experiencing thermal or mechanical fatigue, we utilize an epoxy-underfill process. The epoxy material is dispensed around the perimeter of flip chip IC’s using a Camalot Xyflex Pro. During this process boards are preheated and the epoxy material is drawn under the flip chips by capillary action. After thermal cure the material reinforces the solder joints between the IC package and the substrate or circuit board preventing fracture or elongation of the solder during thermal or mechanical stress.

  • Electrovert (Camalot) Xyflex Pro

Singulation – To help reduce material costs and improve efficiency, we utilize a variety of multi-arrayed boards. Prior to housing assembly, machines will singulate PCBs or substrates into individual circuits.

  • SAS and LAS singulator
  • Pneumatic knife-edge singulator

Dispense – Kokomo Electronic Assembly can dispense a wide range of standard and specialty materials, including thermally-conductive adhesive, electrically-conductive adhesive, conformal coat, passivation gels, and two-part epoxies.

  • Cimple Cell
  • Janome Desktop Robot
  • Universal Polaris
  • Universal GSM

Assembly – Kokomo Electronic Assembly possesses the flexibility to mount odd-form components and assemble electronics within a variety of custom housings.

  • Universal Polaris
  • Cimple Cell
  • Manual and automated screw insertion with torque angle monitoring

Wave and Selective Soldering – We offer a variety of means to connect components onto PCBs, including wave soldering, selective soldering and manual soldering.

  • Soltec solder pot
  • Electrovert solder pot
  • Pillarhouse selective solder
  • Pace soldering system
  • Metcal soldering system

Plastic Laser Welding – We utilize laser welding to weld a plastic cover to a plastic case to form a strong, water-tight seal. This process uses a direct diode source laser, 300W at 980nm, 400uM diameter with fiber optic delivery to a Galvo with nominal 300mm focal length f-theta flat field focus lens.

  • Rofin-Sinar Plastic Laser Welder

Friction Stir Welding – Friction Stir Welding (FSW) is an adiabatic, solid-phase joining process that offers dramatic benefits over traditional joining technologies. Devised and patented by Wayne Thomas at the Welding Institute, UK, FSW plasticizes and mechanically mixes materials by rotational and transversal forces and then forges the non-molten materials together.

Friction Stir Welding can join a variety of metals including the following:

  • Aluminum (all alloys)
  • Brass
  • Copper
  • Lead
  • Magnesium
  • Nickel
  • Steel (tool, stainless)
  • Titanium

Aerospace, Automotive, Military, Railroad, Consumer Electronics industries, et al., have all employed FSW to produce low-defect, high-strength joints.  Because Friction Stir Welding does not melt materials, it avoids defects associated with rapid phase transitions.  Moreover, Friction Stir Welding does not require filler materials or shielding gases, whick lowers process cost, improves process robustness, and reduces operator risk.

Utilizing only a tool with a hardened, protruding, “mixing” probe (or “nib”) and a forging shoulder, Friction Stir Welding does not emit noxious fumes, produce excessive noise, or create harmful byproducts.  This makes Friction Stir Welding a safe, reliable, and repeatable process for a variety of applications.  Click here to view a diagram on Friction Stir Welding.

Compliant Pin – Kokomo Electronic Assembly uses compliant pin (also known as a press-fit solder-free electrical assembly process) for circuit board to connector applications. The pin being inserted has a “compliant” section that is slightly larger than the plated PCB hole. When the pin is inserted, the compliant section is compressed, much like a spring, providing a press-fit connection between the PCB and the pin.

  • Tyco Compliant Pin Press SEP-3T

Heat Stake – We use a heat stake process to eliminate screws for a mechanical attachment of circuit boards to a plastic case. The energy source to heat the boss is infrared light, and the heat transfer mode is radiation (the safe type). The process clamps the parts together, heats the boss evenly with precisely directed infrared light, and forms the plastic with a non-heated punch driven by a low-force pneumatic cylinder.

  • Extol InfraStake® Heat Stake System
  • Dage 4000 wire bond pull and shear tester

Auxiliary Services – Kokomo Electronic Assembly strives to ensure that its printed circuit board assembly and box build tools are among the most reliable and repeatable in the industry.

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