Print Materials and Characteristics

Listed below are Kokomo Thick Film Printing’s standard printing inks and typical ink properties. In addition to those inks listed below we have the ability to make custom formulations in-house or work with our thick film ink suppliers to determine the optimal print material for your application.

Conductors:

Conductive through holes:

  • Coated or plugged
  • Multiple through hole sizes available

Conductor materials available for:

  • Wire bonding
  • Via fill
  • Soldering
  • Routing
  • Heat dissipation
  • High power
  • Buried capacitor

Conductor metallurgies available:

  • Silver – Ag
  • Silver/palladium – AgPd
  • Silver/platinum – AgPt
  • Gold – Au

Conductor characteristics:

  • Aluminum wire bonding
  • Gold wire bonding
  • Line density: 8-mil pitch (3-mil lines x 5-mil spaces) in high volume
  • Single-print fired thickness: 0.4 – 3.0 mils

Dielectrics:

  • Dielectric constant: 8-10 @ 1 MHz
  • Via resolution: down to 6 x 6 mils
  • Crossover dielectric
  • Multilayer dielectric
  • Solder stop dielectric
  • Buried capacitor

Resistors:

  • Standard resistors: 5 ohm/sq to 500 Kohm/sq
  • Sense resistors: 50 mohm/sq to 90 mohm/sq
  • Temperature Coefficient of Resistance (TCR): 0 ± 100 ppm standard, tighter tolerance on request
  • Laser trimming tolerance: ±1%

Materials Lab Services:

  • Resistor blending
  • Material properties analysis
  • Custom conductive formulations
  • Failure analysis testing
  • Ink recovery

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